Compulsory radiation monitoring badges for XRD and SEM work

For all users of the SEM or XRD equipment, the Radiation Worker Registration Form must be filled out and returned to Andrew Giagnacova, (Fax: 215 762-1608, email: Andrew.G.Giagnacova@drexel.edu, Phone: 215-762-6494) or mailed to: Andrew Giagnacova, Radiation Safety, Mail Stop 106, 245 North 15th Street, Philadelphia, PA 19102-1192.

Materials Characterization Equipment

FEI XL30 Environmental SEM with EDS and EBSD

Major Features

• Field emission gun
• ET secondary and solid state backscatter imaging
• High vacuum, variable pressure, and wet modes
• Peltier cooling stage
• EDAX energy-dispersive X-ray microanalysis
• TSL Electron backscattered diffraction (crystallography)
• IR chamber view
• Tensile capability

Zeiss Supra 50VP Scanning Electron Microscope with EDS and WDS

ZEISS´s unique variable pressure technology makes the ZEISS SUPRA 50VP the most versatile analytical FESEM currently available. The ZEISS SUPRA 50VP allows simultaneous EDS and WDS in high vacuum mode. The variable pressure mode adds the advantage of analysing insulating specimens. The short working distance allows simultaneous acquisition of EDS, WDS, SE, BSD, CL and specimen current signals. The extended performance of the GEMINI column delivers ample beam current for the most demanding WDS analysis.

Important Features

• Field emission gun
• ET and in-lens secondary and solid state backscatter imaging
• High vacuum, variable pressure, and high current modes
• Oxford energy-dispersive X-ray microanalysis
• Oxford wavelength-dispersive X-ray microanalysis
• IR chamber view

Amray 1830 Scanning Electron Microscope with Zyvex Nanomanipulator

Important Features

Amray 1830

• Tungsten gun
• ET secondary and solid state backscatter imaging
• High vacuum mode
• IR chamber view

S100 Nanomanipulator System

• The coarse actuator has a 12 mm range of motion in X,Y and Z axes and a resolution of 100 nm
• The fine actuator has a 12 µm range of motion in X and Z axes, 10 µm range of motion in Y axis and a resolution of better than 5 nm
• The Rotational Stage has 360 Degree Continuous Rotation and 3 µradians resolution

Renishaw RM1000 VIS Raman Microspectrometer with 514.5, 633 and 785 nm Excitation

Important Features

• Choice of 514.5 nm, 633 nm, 785 nm excitation for resonance signal enhancement and flourescence supression
• Research grade microscope with image capture capability
• 100 cm-1 cutoff notch filter
• High Spectral/Spatial resolution
• High sensitivity ultra-low noise RenCam CCD detector
• Powerful WiRE™ 2.0 software for intuitive operation and data manipulation
• Heating/Freezing stage
• Raman mapping
• Raman Global Imaging with narrow-band dielectric filters
• Combined Raman/AFM capability with Nanonics MultiView 1000™ system allows direct correlation of AFM topography with Raman maps
• Combined Raman/NSOM mapping capability using Nanonics MultiView 1000™ system
• Allows rapid, non-destructive chemical and structural analysis with easy or no sample preparation (solids, liquids, gases)

Renishaw RM2000 UV Raman Microspectrometer with 244, 325 and 488 nm Excitation

Important Features

• Choice of 244 nm, 325 nm, 488 nm, 514.5 nm excitation for resonance signal enhancement
• Research grade microscope with image capture capability
• 100 cm^-1 cutoff notch filter
• 5 cm^-1 next cutoff filter for study of near-excitation bands
• High Spectral/Spatial resolution
• High sensitivity ultra-low noise RenCam CCD detector
• Powerful WiRE™ 2.0 software for intuitive operation and data manipulation
• Heating/Freezing stage
• Combined Raman/AFM capability with Nanonics MultiView 1000™ system allows direct correlation of AFM topography with Raman maps
• Combined Raman/NSOM mapping using Nanonics MultiView 1000™ system
• Allows rapid, non-destructive chemical and structural analysis with easy or no sample preparation (solids, liquids, gases)

Siemens D500 X-Ray Powder Diffractometer (XRD)

Important Features

• 1500W Cu fine focus tube
• Graphite receiving monochromator
• May decouple drives for thin film work
• Qualitative and quantitative analysis of clays, refractories, fillers, corrosion products, etc
• Jade+ (MDI) analysis software
• Computer-based JCPDS library for rapid, positive phase identifications
• Low angle analysis of crystalline films and coatings

Olympus Metallographic Optical Microscope

Varian Excalibur FTS-3000 and UMA-600 FTIR Microspectrometer with ATR and Reflection Accessories

Important Features

• Optical Resolution: 0.025 cm^-1
• Unapodized Resolution: 0.18 cm^-1
• IR Power: 40 mW at the sample
• Kinetic Scan Rates: 40 spectra/second
• High-throughput optics for faster scanning
• Spectral range: < 50 cm^-1 to 7500 cm^-1
• Pellet making accessories (press and die kit) for transmission studies
• Liquid cell for transmission studies
• Horizontal ATR Accessory for studies of highly absorbing liquids and films with easy sample preparation
• UMA 600 FTIR Microscope Attachment with sensitive MCT detector
• Diamond Single Reflection ATR prism for high spatial resolution studies 

MTS Nanoindenter XP

Important Features

• Displacement resolution: <0.02 nm
• Maximum indentation depth: 500 µm
• Maximum load: 500 mN(50.8gm)
• Load resolution: 50 nN (5.1 µgm)

Micro-Hardness Tester

Important Features

• Loads: 10,25,50,100,200,300,500,1000 grams
• Indentation times range from 5 seconds to 30 seconds
• Knoop or Vickers indenters
• Parallel jaw clamping sample holder
• 0.02mm stage movement in the X and Y directions
• Direct indentation measuring on the sample
• Dual objectives for sample area identification

Microfabrication Equipment

STS (Surface Technology System) Inductive Coupled Plasma (ICP) Deep Reactive Ion Etching (DRIE)

Important Features

• Provides high directional etch
• Features down to 0.1 um or less with aspect ratios of at least 10:1
• Gases include SF6, C4F8, CHF3, Ar, CF4, O2, CO2, He (for back side cooling)
• Controllable sidewall profile
• For Si, oxides, and polymers
• Oxide, metals, or photoresist may be used as the mask
• Etch rates up to 6µm/minute

BOC Edwards A306 E-beam Evaporator

Important Features

• For physical vapor deposition process under high vacuum
• For various metal (Ag, Ag, Al , Ti , Cr, Co) thin film coating
• Handles high temperature materials--good for liftoff
• Highest purity; vacuum better than 1x10-7 torr

Karl Suss MJB-3 Mask Aligner

Important Features

• For contact exposure processes of wafer and substrates
• High resolution manual mask aligner capable to print features of 0.5 µm.
• Wafer and substrate handling up to 4" (wafers), 4"x4" (substrates)
• Special substrate chucks for pieces, III-V materials, thick substrates, hybrids and HF components.
• High precision X, Y, Q alignment stage and microscope manipulator
• High intensity optical setups for different UV- exposure wavelengths up to 90mW/cm²
• Easy access assembly to all parts of the mask aligner

Zygo NewView 6000 Optical Profiler

Important Features

• Non-contact, three-dimensional, scanning white light and optical phase-shifting interferometry
• Vertical z-scan measurement range from 0.1 nm to 15000 µm
• Optical microscope lateral resolution > 0.45 µm to 11.8 µm
• Data scan rate of up to 85 µm/sec with 0.1 nm height resolution
• Step height accuracies of better than 0.75%
• Scan and display areas up to 150 mm x 150 mm

Other

• Dektak IIA Stylus Profilometer
• Various UV Light Sources
• Spin-coater G3P-8