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Microfabrication Facilities & Clean Room Equipment
ICP Deep Reactive Ion Etching (STS)
Important Features
- Provides high directional etch
- Features down to 0.1 um or less with aspect ratios of at least 10:1
- Gases include SF6, C4F8, CHF3, Ar, CF4, O2, CO2, He (for back side cooling)
- Controllable sidewall profile
- For Si, oxides, and polymers
- Oxide, metals, or photo resist may be used as the mask
- Etch rates up to 6 µm/min
E-beam Evaporator (BOC Edwards)
Important Features
- For physical vapor deposition process under high vacuum
- For various metal (Ag, Ag, Al , Ti , Cr, Co) thin film coating
- Handles materials with high melting points - good for lift-off
- Highest purity; vacuum better than 1x10-7 torr
Thermal Evaporator (Thermionics VE 90)
Important Features
- For thermal evaporation of thin metal films with low melting point (Au, Cr, Ag, Al)
- Two thermal stations with W boats
- Quartz crystal thickness monitor
- High vacuum 260 l/sec turbomolecular pump allows pump down within 10 min
- Digital ionization gauge for high vacuum monitoring
- Digital ammeter for the evaporation current
- Evaporation system power: 1kVA, (75 A nominal current)
- For evaporation data of metals, alloys and oxides click here
Optical Profiler (Zygo NewView 6000)
Important Features
- For non-contact surface structure and thin film thickness measurements
- Uses scanning white light interferometry to image and measure the micro structure and topography of surfaces in three dimensions
- Vertical z-scan measurement range from 0.1 nm to 15000 µm
- Optical microscope lateral resolution > 0.45 µm to 11.8 µm
- Data scan rate of up to 85 µm/sec with 0.1 nm height resolution
- Step height accuracies of better than 0.75%
- Scan and display areas up to 150 mm x 150 mm
Mask Aligner (Karl Suss MJB-3)
Important Features
- For contact exposure processes of wafers and substrates
- Manual mask aligner with 0.6 µm resolution and alignment accuracy of 0.1µm
- Wafer and substrate handling up to 4" (wafers), 4"x4" (substrates)
- 3" diameter exposure area
- Special substrate chucks for pieces, III-V materials, thick substrates, hybrids and HF components
- High precision X, Y, Q alignment stage and microscope manipulator
- 350 W mercury short-arch lamp at 365 nm and 405 nm
- High intensity optical setups for exposures up to 90mW/cm²
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