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Microfabrication Facilities & Clean Room Equipment
1/18/2013 Announcement
Microfabrication Facilities and Clean Room Equipment
The University is now proceeding with the long-awaited renovation and upgrade of our microfabrication facility, thanks to the support from the National Science Foundation (NSF OIA 0963319) led by Prof. Hongseok (Moses) Noh and faculty collaborators Profs. Barbee, Baxter, Spanier and Sun, with significant additional financial support from Drexel University.
The following tools will not be available during the construction period:
-ICP Deep Reactive Ion Etching (STS)
-Mask Aligner (Karl Suss MJB-3)
-Laser Ablation System (Resonetics Rapid 250 Workstation)
The following tools will be located in Bossone 110 and available during the construction period:
-Zygo NewView 6000 Optical Profilometer
-BOC Edwards Electron Beam Evaporator (after mid-February)
-Thermionics VE 90 Thermal Evaporator (after mid-February)
ICP Deep Reactive Ion Etching (STS)
Contact: Edward Basgall
Important Features
- Provides high directional etch
- Features down to 0.1 um or less with aspect ratios of at least 10:1
- Gases include SF6, C4F8, CHF3, Ar, CF4, O2, CO2, He (for back side cooling)
- Controllable sidewall profile
- For Si, oxides, and polymers
- Oxide, metals, or photo resist may be used as the mask
- Etch rates up to 6 µm/min
E-beam Evaporator (BOC Edwards)
Contact: Edward Basgall
Important Features
- For physical vapor deposition process under high vacuum
- For various metal (Ag, Ag, Al , Ti , Cr, Co) thin film coating
- Handles materials with high melting points - good for lift-off
- Highest purity; vacuum better than 1x10-7 torr
Thermal Evaporator (Thermionics VE 90)
Contact: Edward Basgall
Important Features
- For thermal evaporation of thin metal films with low melting point (Au, Cr, Ag, Al)
- Two thermal stations with W boats
- Quartz crystal thickness monitor
- High vacuum 260 l/sec turbomolecular pump allows pump down within 10 min
- Digital ionization gauge for high vacuum monitoring
- Digital ammeter for the evaporation current
- Evaporation system power: 1kVA, (75 A nominal current)
- For evaporation data of metals, alloys and oxides click here
Optical Profiler (Zygo NewView 6000)
Contact: Sahar Javedani
Important Features
- For non-contact surface structure and thin film thickness measurements
- Uses scanning white light interferometry to image and measure the micro structure and topography of surfaces in three dimensions
- Vertical z-scan measurement range from 0.1 nm to 15000 µm
- Optical microscope lateral resolution > 0.45 µm to 11.8 µm
- Data scan rate of up to 85 µm/sec with 0.1 nm height resolution
- Step height accuracies of better than 0.75%
- Scan and display areas up to 150 mm x 150 mm
Mask Aligner (Karl Suss MJB-3)
Contact: Sahar Javedani
Important Features
- For contact exposure processes of wafers and substrates
- Manual mask aligner with 0.6 µm resolution and alignment accuracy of 0.1µm
- Wafer and substrate handling up to 4" (wafers), 4"x4" (substrates)
- 3" diameter exposure area
- Special substrate chucks for pieces, III-V materials, thick substrates, hybrids and HF components
- High precision X, Y, Q alignment stage and microscope manipulator
- 350 W mercury short-arch lamp at 365 nm and 405 nm
- High intensity optical setups for exposures up to 90mW/cm²
Laser Ablation System (Resonetics RapidX 250 Workstation)
Contact: Sahar Javedani
Important Features
- Excimer laser based micromachining system for wide variety of applications including MEM fabrication, microfluidics, general purpose microfabrication, marking and wire stripping, as well as various medical applications
- The system can laser machine polymers, glass, sapphire, ruby, silicon, ceramics and metals among others
- Choice of two laser wavelengths, 248 nm and 193 nm, for best results on different materials
- Designed for 2-D and 3-D laser micromachining
- Computer controlled 200mm x 200mm XY stage, with goniometer (45 degree tilt), permitting the most complex geometries to be machined
- System's feature resolution: from 1 micron to 1 mm
- Micromachining of blind holes, blind channels and grooves
- Micro hole drilling, micro milling
- Laser stripping, cutting and trimming
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