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Microfabrication Facilities & Clean Room Equipment

02/03/2014 Announcement

Re-Opening of the Microfabrication Facilities

Dear Students and Colleagues,

Following the completion of a major renovation project I am very pleased to announce the re-opening of the newly renovated MicroFabrication Facility (MFF) within the CRF, a Drexel University Core Facility.   

Walking by the MFF on the third floor of LeBow Engineering, you have likely noticed construction resulting in a view into a new laboratory containing class 10,000 and class 100 cleanroom spaces and instruments dedicated for Drexel research involving micro-fabrication. Staff member Dr. Ed Basgall and others have been working to restore to operating status capabilities such as photo- and soft lithography, thin film deposition, wet chemical and plasma etching, and thin film analysis such as optical profilometry, and a press suitable for annealing co-polymer (e.g. PVDF/TrFE) films. (Please visit http://crf.coe.drexel.edu/instruments/microfabrication)  In February, the CRF/MFF will take delivery of a Park Model NX10 Atomic Force Microscope/Scanning Probe Microscope (AFM/SPM) having a wide array of scanning modes are available in addition to standard imaging, including a collection of local property mapping modes. Training for and access to this instrument will be announced and made available to all users following its installation in the class 10,000 cleanroom, although this location is subject to change dependent on instrument performance. 

Former and new users of the MFF are encouraged to contact the staff to request scheduled safety and instrument training and qualified access to the Facility. To encourage returning users to return and to invite new users to learn how these facilities can benefit their research, the staff and I will be offering brief Facility tours to groups of up to 6 persons at a time on Fridays Feb. 7 and 14 beginning at 12:00 noon, and to answer questions about current and planned capabilities and processes. The CRF will also waive user training and access fees to the MFF for the period of February through April. (Users/PIs will be responsible for the costs of materials and supplies and must still complete an online user subscription form to be approved by their supervisor/advisor.) Former and prospective users, including faculty, are encouraged to contact Dr. Ed Basgall regarding technical questions and training. Access for training and user qualification is handled individually and is subject to staff availability on a first-come, first-served basis. Become a Drexel Core Facilities User   

We hope that the newly renovated lab provides you with convenient access to capabilities and processes you need for your research. Please don't hesitate to contact me if you have any questions and suggestions on how this facility and our team can assist you with your research.

Sincerely,

Jonathan E Spanier, PhD
Director of the Centralized Research Facility | A University Core Facility
Associate Professor of Materials Science & Engineering
spanier@drexel.edu
215.895.2301 (phone)


 ICP Deep Reactive Ion Etching (STS)

Contact: Edward Basgall

 

Important Features

  • Provides high directional etch
  • Features down to 0.1 um or less with aspect ratios of at least 10:1
  • Gases include SF6, C4F8, CHF3, Ar, CF4, O2, CO2, He (for back side cooling)
  • Controllable sidewall profile
  • For Si, oxides, and polymers
  • Oxide, metals, or photo resist may be used as the mask
  • Etch rates up to 6 µm/min

E-beam Evaporator (BOC Edwards)

Contact: Edward Basgall

 

Important Features

  • For physical vapor deposition process under high vacuum
  • For various metal (Ag, Ag, Al , Ti , Cr, Co) thin film coating
  • Handles materials with high melting points - good for lift-off
  • Highest purity; vacuum better than 1x10-7 torr

Thermal Evaporator (Thermionics VE 90)

Contact: Edward Basgall

 

Important Features

  • For thermal evaporation of thin metal films with low melting point (Au, Cr, Ag, Al)
  • Two thermal stations with W boats
  • Quartz crystal thickness monitor
  • High vacuum 260 l/sec turbomolecular pump allows pump down within 10 min
  • Digital ionization gauge for high vacuum monitoring
  • Digital ammeter for the evaporation current
  • Evaporation system power: 1kVA, (75 A nominal current)
  • For evaporation data of metals, alloys and oxides click here

Optical Profiler (Zygo NewView 6000)

Contact: Edward Basgall

 

Important Features

  • For non-contact surface structure and thin film thickness measurements
  • Uses scanning white light interferometry to image and measure the micro structure and topography of surfaces in three dimensions
  • Vertical z-scan measurement range from 0.1 nm to 15000 µm
  • Optical microscope lateral resolution > 0.45 µm to 11.8 µm
  • Data scan rate of up to 85 µm/sec with 0.1 nm height resolution
  • Step height accuracies of better than 0.75%
  • Scan and display areas up to 150 mm x 150 mm

Mask Aligner (Karl Suss MJB-3)

Contact: Edward Basgall

 

Important Features

  • For contact exposure processes of wafers and substrates
  • Manual mask aligner with 0.6 µm resolution and alignment accuracy of 0.1µm
  • Wafer and substrate handling up to 4" (wafers), 4"x4" (substrates)
  • 3" diameter exposure area
  • Special substrate chucks for pieces, III-V materials, thick substrates, hybrids and HF components
  • High precision X, Y, Q alignment stage and microscope manipulator
  • 350 W mercury short-arch lamp at 365 nm and 405 nm
  • High intensity optical setups for exposures up to 90mW/cm²

Laser Ablation System (Resonetics RapidX 250 Workstation)

Contact: Edward Basgall

 

Important Features

  • Excimer laser based micromachining system for  wide variety of applications including MEM fabrication, microfluidics, general purpose microfabrication, marking and wire stripping, as well as various medical applications
  • The system can laser machine polymers, glass, sapphire, ruby, silicon, ceramics and metals among others 
  • Choice of two laser wavelengths, 248 nm and 193 nm, for best results on different materials 
  • Designed for 2-D and 3-D laser micromachining
  • Computer controlled 200mm x 200mm XY stage, with goniometer (45 degree tilt), permitting the most complex geometries to be machined  
  • System's feature resolution: from 1 micron to 1 mm 
  • Micromachining of blind holes, blind channels and grooves 
  • Micro hole drilling, micro milling
  • Laser stripping, cutting and trimming 

Carver Heated Press


with Digital Temperature Controls & Safety Shield
25 TON PRESS No. 3856. Used for molding, laminating, embossing, and bonding of various materials, suitable for annealing co-polymer (e.g. PVDF/TrFE piezoelectric/electrostrictive) films, to 150C

 

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